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Responsibilities:

61 Lead the full-process management of SMT technology, including parameter setting, optimization and implementation such as solder paste printing, SPI, component placement, reflow, AOI etc.
61 Develop and characterize SMT processes tailored including reflow carriers, stencil design and optimization, solder paste selection and reflow profile etc.
61 Develop and validate all SMT programs (Stencil, placement, reflow, SPI/AOI)
61 Manage the SMT build of proto, EVT, DVT. Analyze and resolve all SMT related defects, providing detail feedback to team for DFM issues
61 Design and execute SMT process qualification and GRR study. Create SMT related documents such as control plan, PFMEA, SOP etc.
61 Troubleshooting and resolving abnormalities in the SMT production process
61 SMT yield and efficiency improvement.
61 Assist production for operator training.

職責描述：

· 全面負責SMT工藝全流程管理，包括錫膏印刷、SPI、元件貼裝、回流焊、AOI等環節的參數設定、優化與實施
· 開發并完善定制化SMT工藝方案，涵蓋回流焊載具設計、鋼網設計與優化、錫膏選型、回流焊溫度曲線調試等
· 編制并驗證所有SMT加工程序（鋼網程序、貼裝程序、回流焊程序、SPI/AOI檢測程序）
· 主導原型機、工程驗證、設計驗證階段的SMT生產，分析解決SMT相關缺陷，針對DFM問題向團隊提供詳細改進建議
· 設計并執行SMT工藝認證與GRR分析，編制控制計劃、PFMEA、標準作業指導書等工藝文檔
· 及時診斷并解決SMT生產過程中的異常問題
· 持續提升SMT直通率與生產效率
· 協助生產部門進行操作員培訓

Qualifications:

61 Bachelor’s degree or above in Electrical/Mechanical etc.
61 Good English listening, writing